Semiconductor power module having an improved composite board and method of fabricating the same
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United States of America Patent
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-
May 28, 1996
Grant Date -
N/A
app pub date -
Jul 5, 1994
filing date -
Jul 5, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An insulating metallic board 160 mounting IGBTs which control an electrical power and other circuit elements and an insulating board 170 mounting semiconductor elements which control the IGBTs and the other circuit elements are arranged adjacent to or closely parallel to each other, and combined by a frame 180 into one integral circuit board to define a composite board 150. Wiring patterns 161 and 171 on which the respective circuit elements are to be disposed are formed on major surfaces of the same side. Since the composite board 150 which includes the two different types of circuit boards can be treated simply as one board, it is possible to mount the circuit elements onto the two different types of boards at the same time in one fabrication step. Thus, the number of fabrication steps and a manufacturing cost are reduced.
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