Microwave hybrid coupler
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United States of America Patent
Stats
-
May 28, 1996
Grant Date -
N/A
app pub date -
Jun 5, 1995
filing date -
Jun 5, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A hybrid coupler which includes a substrate of an insulating material having a pair of opposed surfaces. A conductive ground plane is on one of the substrate surfaces. A pair of conductive transmission lines are over the other substrate surface and a layer of a dielectric material is over the other substrate surface. Each of the transmission lines has one portion which is on the substrate surface and under the dielectric layer, another portion which is over the dielectric layer and a connecting portion which electrically connects the two portions of the transmission line. Each of the connecting portion extends through an opening in the dielectric layer and one of the connecting portions crosses over the other connecting portion. The portions of the transmission lines may extend in straight lines, in a serpentine path or in a rectangular path. The portions of the transmission lines have ports at one end with the ports of the one portions of the lines being adjacent the same edge of the substrate, and the ports of the other portions of the lines being adjacent the same edge of the substrate.
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