Particle removal in supercritical liquids using single frequency acoustic waves
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United States of America Patent
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Jun 4, 1996
Grant Date -
N/A
app pub date -
Aug 8, 1994
filing date -
Aug 8, 1994
priority date (Note) -
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Abstract
A method and apparatus for particle removal in supercritical fluids using a single frequency acoustic wave. A wafer (114) is placed in a process chamber (110) and cleaning gas is introduced through inlet port (116). The cleaning fluid is heated to at least the critical temperature of the cleaning fluid and may also be pressurized. A sonic wave is generated in process chamber (110) by sonic transducer (122) to create alternating bands of gas phase (G) and supercritical phase (SC) of the cleaning fluid. The sonic wave is preferably a traveling wave such that the gas (G) and supercritical (SC) phases move across the surface of wafer (114) removing contaminants from the wafer (114) and trapping them in the acoustic wave. The contaminants are then removed from the system with spent cleaning fluid through outlet port (118).
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