Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips
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United States of America Patent
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Jun 4, 1996
Grant Date -
N/A
app pub date -
Aug 5, 1994
filing date -
Aug 5, 1994
priority date (Note) -
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Abstract
A method and apparatus for protecting metal bumped chips during processing and for providing mechanical support to interconnected chips. A protective adhesive stop is affixed to a metal bumped chip so that the height of the stop is at least as high as the metal bump. The stop protects the metal bump during routine handling. When the chip is interconnected to another bumped chip by cold welding their respective metal bumps, the stop contacts the face of the second chip and provides mechanical support. The stop is preferably a thermoplastic that is heated to adhere it to the second chip. The addition of the protective stop facilitates automated processing of metal bumped chips, and provides stronger, faster, and lower power chips.
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