Printed circuit board comprising elevated bond pads
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United States of America Patent
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-
Jun 4, 1996
Grant Date -
N/A
app pub date -
Jan 3, 1994
filing date -
Jan 3, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board (10) comprises a polymeric coating (30) and a metal circuit trace (26) applied to a substrate (22). The coating defines an opening (32) whereat the substrate is uncoated. The metal circuit trace includes a runner section (28) that is covered by the polymeric coating and a bond pad (20) integrally formed to the runner section at the opening and having an upper surface (40) that includes lip (36) overlying the polymer coating to facilitate positioning of a component for solder bonding to the pad. The bond pad preferably also includes a surface accessible within the opening to enhance solder bonding to the bond pad.
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