Flatline method of drying wafers
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United States of America Patent
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Jun 11, 1996
Grant Date -
N/A
app pub date -
Feb 14, 1995
filing date -
Feb 14, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
Drying of particulate materials, such as wood chips (wafers/strands) for the manufacture of oriented structural board, as well as bark, and the like. The method is characterized by advancing wafers in random array and superposed and without contact above a planar surface; forcing heated air upwardly through spaced apart holes defined in the stationary planar surface and through the random array of advancing wafers, while evacuating heated air and accumulated moisture above the advancing wafers. The method is distinguished by lateral shielding during forcing of heated air above the planar surface, so as to inhibit 'blow-holes' among the drying wafers.
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