Cavity and bump interconnection structure for electronic packages
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United States of America Patent
Stats
-
Jun 11, 1996
Issued Date -
N/A
app pub date -
Feb 15, 1995
filing date -
Dec 17, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Electronic interconnection of two printed wiring structures. Two printed wiring boards or a flexprint circuit and a printed wiring board are interconnected by creating a plated hole pattern on a surface of the printed wiring board, and wherein holes of the pattern have a concave cross section. The holes of the plated hole pattern are mated with corresponding bumps or dimples disposed on the second printed wiring board or the flexprint circuit. The holes formed in the first printed wiring board are disposed a predetermined depth below a surface of the printed wiring board, typically to a depth of between 0.007 inches and 0.020 inches below the surface. The plurality of plated holes are formed by electroless plating or electroplating of the holes. The present interconnection structure provides for reliable and self aligning interconnection of the two printed wiring boards or the flexprint circuit and printed wiring board.
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Cited Art Landscape
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