Fabrication method for digital micro-mirror devices using low temperature CVD
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United States of America Patent
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Jun 18, 1996
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N/A
app pub date -
Sep 30, 1994
filing date -
Sep 30, 1994
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Abstract
An improved support post (16, 23) for micro-mechanical devices (10). A conductive layer (33, 71) is deposited on a substrate at all places where the support posts (16, 23) are to be located. A spacer layer (41, 81) is then deposited and etched to form vias (41a, 81a). Each via (41a, 81a) defines the outer surface of a support post (16, 23). The bottom surface of each via is at the conductive layer (33, 71). This permits an aluminum CVD process to selectively fill the vias (41a, 81a), thereby forming the support posts (16, 23).
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