Chemical mechanical polishing slurry for metal layers

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United States of America Patent

PATENT NO 5527423
SERIAL NO

08319213

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Abstract

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A slurry for use in chemical-mechanical polishing of a metal layer comprising high purity fine metal oxide particles uniformly dispersed in a stable aqueous medium.

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Patent Owner(s)

Patent OwnerAddress
CABOT MICROELECTRONICS CORPORATION870 NORTH COMMONS DRIVE AURORA IL 60504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fluck, David J Pesotum, IL 12 606
Hung, Cheng-Hung Champaign, IL 58 1337
Lucarelli, Michael A Mattoon, IL 28 768
Neville, Matthew Champaign, IL 6 629
Scherber, Debra L Orangevale, CA 2 702

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