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Abstract

An electronic circuit package comprising an electrically conductive pattern embedded within a curable material. The curable material comprises a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structure N.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.N and the fluorine containing arylene ether polymer has the structure X--R--[R.sup.1 ].sub.m --X wherein X is any group capable of reacting with a --C.tbd.N group; R is an aliphatic or aromatic group which may or may not be fluorosubstituted; R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted; n is 0-10; and m is 0-100. The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.

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First Claim