Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit
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United States of America Patent
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Jun 18, 1996
Issued Date -
N/A
app pub date -
Nov 21, 1994
filing date -
Mar 29, 1993
priority date (Note) -
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Abstract
An ink composition is provided for forming an ultra-thick thick film which is suitable for conducting heat laterally from a heat generating device supported on a substrate. The ink composition is formulated to enable the ultra-thick thick film to be formed as a single layer, such that only a single print, dry and fire cycle is required to form the film. Advantageously, ultra-thick thick films having thicknesses of about 125 micrometers (about 0.005 inch) and greater can be formed by a single layer of the ink composition.
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