Fabrication and structures of circuit modules with flexible interconnect layers
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United States of America Patent
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Jun 18, 1996
Grant Date -
N/A
app pub date -
Oct 11, 1994
filing date -
Oct 11, 1994
priority date (Note) -
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Abstract
A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having chip pads is attached to the second surface of the base insulative layer. Respective vias are formed to expose selected portions of the first patterned metallization layer, the second patterned metallization layer, and the chip pads. A patterned outer metallization layer is applied over the outer insulative layer to extend through selected ones of the vias to interconnect selected ones of the chip pads and selected portions of the first and second metallization layers.
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