Wafer method for breaking a semiconductor
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United States of America Patent
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-
Jun 18, 1996
Issued Date -
N/A
app pub date -
Nov 21, 1994
filing date -
Jan 7, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A process for partially sawing the streets on semiconductor wafers. After sawing the streets can be covered by a protective material, and then the wafer continues its processing as before. After the wafer is broken, the protective material may or may not be removed. Additionally, the wafer may be broken into individual chips using a wedge piece that has a number of individual wedges on it, where the individual wedges press against the partially sawn streets, causing the wafer to break.
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