Hot melt adhesive composition
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United States of America Patent
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Jun 18, 1996
Grant Date -
N/A
app pub date -
Jul 15, 1993
filing date -
Jul 15, 1993
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Abstract
A hot melt adhesive composition is described which possesses properties which are desirable with respect to the construction of disposable articles. The adhesive composition includes about 10% to about 80%, by weight, of an alkali soluble polymer; about 0 to about 30%, by weight, of a poly (vinyl methyl ether); about 30% to about 70%, by weight, of a tackifying resin; and about 5% to about 30%, by weight, of a suitable plasticizer.
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