Multilayer conductor for printed circuits
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United States of America Patent
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Jun 18, 1996
Grant Date -
N/A
app pub date -
Feb 21, 1995
filing date -
Feb 21, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multilayer circuit is provided characterized by a multilayer conductor structure. The multilayer conductor structure is composed of at least two conductor layers, with each adjacent layer being separated by a dielectric material in the form of one or more dielectric layers. The multilayer circuit further includes electrically conductive members or features for electrically interconnecting the conductor layers at two or more locations along the lengths of the conductor layers. As a result, portions of the conductor layers between two or more locations are electrically in parallel with each other, such that the multilayer conductor is characterized by an electrical resistance between the locations which is less than the electrical resistance of the individual conductor layers between the locations. The multilayer conductor is therefore characterized by an augmented current-carrying capacity as compared to a single layer conductor of the same length and width.
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