Thin film chip capacitor for electrical noise reduction in integrated circuits
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United States of America Patent
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-
Jun 18, 1996
Grant Date -
N/A
app pub date -
Oct 4, 1994
filing date -
Oct 4, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit chip and flat capacitor assembly are connected with short bonding wires to reduce electrical noise. A flat chip capacitor is coupled to the chip and includes a first electrode, a second electrode and a dielectric layer disposed between the electrodes. The ground and power bonding pads of an integrated circuit chip are coupled to a number of terminals arranged in a row near the outer edge of the capacitor, where each of the terminals is coupled to one of the electrodes. The terminals of the capacitor are connected to a number of package leads of a lead frame or a other integrated circuit package. The invention includes embodiments in which the chip is placed on top of the capacitor, the capacitor is placed on top of the chip, and a flex circuit of a micro ball grid array is placed on a capacitor which is positioned on a chip.
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