Method for non-destructive, non-contact measurement of dielectric constant of thin films
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 18, 1996
Grant Date -
N/A
app pub date -
Nov 7, 1994
filing date -
Nov 7, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for measurement of dielectric constant of a thin film is disclosed which is non-destructive and avoids contact with the film and the substrate carrying it. A first characteristic of the substrate is measured using a capacitance measuring device. Then, the thin film is deposited on the substrate. The first characteristic of the substrate is measured a second time after the film has been deposited. Thereafter, the true film thickness is measured. A ratio of the measurements made with the capacitance measuring device is then established with the actual thickness measurement. The dielectric constant can then be derived from a lookup table or graph calibrated for the tools being used for the measurements.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully