Method of making subsurface electronic circuits
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United States of America Patent
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-
Jul 2, 1996
Issued Date -
N/A
app pub date -
Aug 27, 1993
filing date -
Nov 14, 1989
priority date (Note) -
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status (Latency Note)
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Abstract
A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith is disclosed. First, three dimensional, essentially square channels interspersed with lands are formed within a dielectric material on a substrate. The channels are then filled in one pass with a curable polymeric material containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components are place to engage the conductive material. The curable material is then cured after placing the electronic component(s).
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