Method for making IC card having severable mini chip card
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United States of America Patent
Stats
-
Jul 2, 1996
Issued Date -
N/A
app pub date -
Aug 11, 1994
filing date -
Mar 7, 1990
priority date (Note) -
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status (Latency Note)
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Abstract
A method for producing a mini chip card out of a standard card having an embedded semiconductor chip uses a punching die with cutting edges defining the outer contour of the mini chip card. The punching die is adjusted relative to the standard card and with respect to contact surfaces of the embedded semiconductor chip so that the edges of the punching die are at a predetermined distance from the contact surfaces. The punching of the standard card is performed in this adjusted position so that the contact surfaces are in a reference position with respect to the outer contour of the mini chip card. The punching forms the mini chip card in the correct position in the standard card. The mini chip card may initially remain connected to the standard card by thin bars between the cards.
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