Importance

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Abstract

A method for sealing apertures caused by manufacturing processes in micromechanical acceleration sensors is disclosed whereby apertures or recesses, serving for leading the conductor paths out of the oscillation space of an acceleration sensor without causing short circuits, can be sealed in a gas-tight manner in a simple way. The conductor paths establish the conducting connection between junction contacts of the acceleration sensor accessible from the outside with electrodes which are allocated on both sides to the oscillating mass of the acceleration sensor which is also configured as an electrode. The method provides to use an adhesive, which is curable or hardenable by means of light, and in particular, ultraviolet light. A specific quantity of the adhesive is applied at a certain point of the acceleration sensor and, after an experimentally determined distribution time period has elapsed, after which the adhesive has also penetrated into the recesses under the influence of capillary effect and has sealed same, is hardened or cured by exposure to light. The sealing process occurs in a nitrogen atmosphere. Prior to the above, the oscillation space was evacuated.

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First Claim