Method of spiral resist deposition
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United States of America Patent
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Jul 2, 1996
Issued Date -
N/A
app pub date -
Dec 14, 1994
filing date -
Sep 8, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A method of depositing a material upon a substrate is disclosed. A material, such as photoresist, is deposited upon a substrate such as a semiconductor wafer by spinning the substrate and commencing deposition at the edge of the wafer and moving inward in a spiral pattern. The method produces a more uniform coating than hitherto available.
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