Ceramic probe card and method for reducing leakage current
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United States of America Patent
Stats
-
Jul 2, 1996
Grant Date -
N/A
app pub date -
Apr 6, 1995
filing date -
Apr 6, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrical probe card for parametric testing of microelectronics having reduced leakage current, includes a hydrophobic layer of a self curing silicone material coating the entire exposed surface of the ceramic card between exposed conductors. The hydrophobic layer has a thickness of less than 1 micrometer, preferably less than 0.1 micrometer and most preferably between 0.01 and 0.001 micrometers. The hydrophobic layer does not interfere with subsequent soldering to the contacts on the card, is inexpensive, solvent resistant and easily applied to new and pre-existing probe cards. The method of application involves applying an excess of the hydrophobic silicone material in its uncured state, followed by vigorously wiping excess material off to thin the layer, produce a good bond and clean the exposed conductors on the probe card.
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