Apparatus for testing semicondctor wafer
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United States of America Patent
Stats
-
Jul 2, 1996
Grant Date -
N/A
app pub date -
Aug 25, 1994
filing date -
Aug 25, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The apparatus for collectively burning-in or testing a plurality of semiconductor chips disposed on a wafer without dicing the chips into individuals, the apparatus including a testing substrate, an active circuit disposed on the testing substrate for activating chips disposed on the wafer to be tested, a plurality of pads disposed on the testing substrate and positioned so that the pads are disposed in alignment with bonding pads of the chips disposed on the wafer when the testing substrate is overlaid on the wafer, and an anisotropic conductive layer disposed on the pads.
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