Importance

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Abstract

This invention provides a method and apparatus for automatically locating the bond of a wire to a lead flame and semiconductor chip or similar device as an in-process operation to facilitate in-process inspection. The apparatus includes a wire bonding machine, or similar apparatus, having a movable platform such as an X-Y table for holding semiconductor chips situated in lead frames; a video camera or other optical sensing or imaging device for generating images, which camera is typically positioned over the target chip and lead flame to be bonded; illumination means for illuminating the chip in a lead flame; an image processor capable of digitizing and analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform, the camera and the image processor. The apparatus generates and stores a pre-bond digital image of the semiconductor chip in the lead flame before bonding has occurred; connects one or more wires between the chip and lead frame by any of a number of means such as ultrasonic bonding, heat bonding, conductive glue bonding or other means; generates and stores a post-bond digital image of the now-bonded chip in its lead frame; registers the pre-bond and post-bond stored digital images so that analysis can be done; and permits inspection of the results of the wire bonds according to appropriate criteria.

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First Claim