Solder wave measurement device
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United States of America Patent
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Jul 9, 1996
Issued Date -
N/A
app pub date -
Nov 21, 1994
filing date -
Nov 21, 1994
priority date (Note) -
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Abstract
In a wave solder manufacturing process, a test device is used to measure the contact-area between a solder wave and a printed wiring board. In particular, the test device is a printed wiring board (PWB) that includes at least two arrays of electrical contacts, one array near each side of the PWB. As the PWB makes contact with a solder wave, the number of electrical contacts in each array that are grounded by the solder wave are counted and displayed on an alpha-numeric display mounted on top of the PWB. This 'distance-based' measurement provides an accurate determination of the uniformity of the contact-area, and concomitantly the dwell-time of the soldering process.
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