Importance

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Abstract

A resin molded CCD package and a method for preparing the CCD package by employing a transfer molding using a low-priced plastic material having a good moldability. This package comprises a semiconductor chip as a CCD, a lead frame being integrally provided with a paddle and a plurality of leads, a film wall being attached to an upper surface of the semiconductor chip such that it surrounds a light reception region of the semiconductor chip, a glass lid for sealing the light reception region and transmitting an outside light to the region, a plurality of metal wires for electrically connecting a plurality of bond pads of the semiconductor chip to individual inner leads of the lead frame, and a mold resin package body for hermetically sealing a predetermined part including the semiconductor chip and the inner leads, both being wire-bonded to each other. The present invention simplifies the preparation process of the CCD package, reduces the preparation cost and achieves the recent trend of compactness and requirement of mass production of the CCD package.

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First Claim