Apparatus for surface mounting flip chip carrier modules
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United States of America Patent
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-
Jul 16, 1996
Issued Date -
N/A
app pub date -
May 25, 1995
filing date -
Jan 7, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for handling and storing surface-mount, encapsulated flip-chip carrier modules to prevent the formation of amoeba-like solder bridges between the flip-chip C4 connections along the boundary between the encapsulant and the chip surface and/or between the encapsulant and the chip carrier substrate surface. The concentration of free moisture in the encapsulant is maintained below a predetermined safe limit during reflow heating used to mount the modules on a circuit board.
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