Heat treatment apparatus utilizing flat heating elements for treating semiconductor wafers
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United States of America Patent
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Jul 16, 1996
Issued Date -
N/A
app pub date -
May 16, 1994
filing date -
Aug 16, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat treatment apparatus including a flat heat source having a plural number of ring-shaped heating units of different diameters arranged concentrically and so as to face a processing surface of a semiconductor wafer for example, a heat control portion which performs either independent or batch control of a plural number of ring-shaped heating units, a process tube which houses the object for processing, and a movement mechanism which brings a processing surface of the object for processing and the flat heat source into relative proximity. By this configuration, it is possible to have fast heat treatment such as oxidation and diffusion processing, or CVD processing, to a uniform temperature for the entire processing surface of a flat object for processing.
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