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Abstract

A power module having a reduced cost and a smaller size is achieved by utilizing a reduced number of MOS-FET devices owing to improved heat radiation, smaller substrates owing to, a higher degree of freedom of wiring, and a reduced quantity of silicone get required. Heat generating elements including a MOS-FET and a resistor are soldered to a metallic heat radiating plate via a copper heat sink, alumina insulating plate, or the like. A circuit pattern for the heat generating elements is formed on a metallic substrate provided above the metallic heat radiating plate. Openings are made in the metallic substrate at the points located above the heat generating elements and the heat generating elements are connected to the metallic substrate with aluminum wires through the openings. Further, rings surrounding the heat generating elements are provided between the metallic heat radiating plate and the metallic substrate, a protective material being charged in the rings.

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First Claim