Encapsulation of electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 16, 1996
Issued Date -
N/A
app pub date -
Oct 28, 1994
filing date -
Aug 28, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
For physical protection and to reduce stress, an electronic device (10) is mounted within a cavity in a housing (14) which constitutes an encapsulating member. The housing is preferably formed as two premoulded piece parts (14a, 14b). A leadframe (12) extends into the housing (14) in the manner of a sandwich construction. The device (10) may be mounted on a heat sink (16).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully