Method of bumping substrates by contained paste deposition
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United States of America Patent
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-
Jul 23, 1996
Grant Date -
N/A
app pub date -
Aug 8, 1994
filing date -
Aug 8, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solder bump is stenciled into a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls
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