Temperature controlled multi-layer module
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United States of America Patent
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-
Jul 23, 1996
Grant Date -
N/A
app pub date -
Dec 9, 1992
filing date -
Dec 9, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-layer module that has incorporated therein an additional sheet with a heat generating film resistor formed thereon. A temperature responsive controller regulates the film resistor current in order to regulate the temperature at the surface of the module. The invention is applicable to both single chip and multiple chip modules, and for multi-chip modules a plurality of discrete film resistors on a single may be used.
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