Semiconductor device and resin for sealing a semiconductor device
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United States of America Patent
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Jul 23, 1996
Issued Date -
N/A
app pub date -
Mar 17, 1995
filing date -
Jun 22, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is disclosed a semiconductor device wherein electrode terminals (2), elements (6) and wires (7) are disposed on a base plate (5) of a case (4) filled with only epoxy resin (1). The epoxy resin (1) contains impurities such as halogen and alkaline metallic salts in an amount of not more than 5 ppm and has a linear expansion coefficient of 5.times.10.sup.-6 to 25.times.10.sup.-6 when hardened. The semiconductor device provides for direct sealing of the components, whereby its size and cost are reduced.
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