Method of forming triniobium tin superconductor
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United States of America Patent
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Jul 30, 1996
Grant Date -
N/A
app pub date -
Jun 14, 1995
filing date -
Jun 14, 1995
priority date (Note) -
Expired
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Abstract
The solid-liquid diffusion process used to form triniobium tin superconductor is improved by oxidizing the tin coated niobium substrate with an oxide layer on the surface of the tin coat after tin dipping. The oxide layer can be added to the tin coat by passing the tin coated niobium substrate through an oxidizing chamber before the reaction anneal step, by adding oxygen to the reaction anneal furnace with argon or helium, by adding oxygen to the cooling tower immediately after the tin dipping process, or by controlling the exit temperature of the tin coated substrate from the tin dip in room atmosphere conditions.
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