High frequency microelectronic circuit enclosure
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United States of America Patent
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Jul 30, 1996
Grant Date -
N/A
app pub date -
May 22, 1995
filing date -
May 22, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An enclosure assembly for a high frequency integrated circuit. The enclosure assembly includes a plurality of lead terminals that are part of a lead frame. The lead terminals are connected to electrical ports of the circuit within the enclosure to connect the circuit to other integrated circuits and/or to a printed circuit board. A portion of the lead terminals outside of the enclosure has a specially shaped flared region that establishes the characteristic impedance of the circuit on the lead lines outside of the enclosure.
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