Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate

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United States of America Patent

PATENT NO 5542601
SERIAL NO

08394684

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A new rework process for semiconductor chips mounted in a flip chip configuration, via solder balls, on an organic substrate is disclosed.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fallon, Kenneth M Vestal, NY 12 639
Jimarez, Miguel A Newark Valley, NY 26 649
Zdimal, Joseph E Binghamton, NY 1 131

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