Importance

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Abstract

A system for probing both sides of a high density printed circuit board includes an open frame extending around the circuit board when it is held in a test position by a circuit board carrier. The frame includes two parallel rail structures extending above, and at opposite ends of, the circuit board in the test position. The frame also includes another two parallel rail structures extending below, and at opposite ends of, the circuit board. The upper and lower rail structures extend perpendicularly to one another, and are fastened together at the corners of the frame by means of compression bolt assemblies. Two gantry structures are moved in a first direction between the upper rail structures, while two other gantry structures are moved in a direction perpendicular to the first direction between the lower rail structures. A carriage moves along each gantry structure, and a probe is mounted on each carriage to be moved toward and away from the adjacent surface of the circuit board. The circuit board is moved by a board carrier between a position, outside the frame, in which it is loaded and unloaded, and the test position.

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First Claim