Structure having different levels of programmable integrated circuits interconnected through bus lines for interconnecting electronic components
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United States of America Patent
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Aug 6, 1996
Issued Date -
N/A
app pub date -
Dec 22, 1993
filing date -
Sep 20, 1989
priority date (Note) -
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Abstract
A structure for interconnecting electronic components contains a group of first programmable integrated circuits (331-1-331-3 and 331-5-331-7), at least one second programmable integrated circuit (331-4) and at least one substrate (300), typically a printed circuit board. The first programmable integrated circuits are connected through conductive traces to component contacts formed on the substrate(s) for receiving the electronic components. The first programmable integrated circuits are also connected through bus lines (333-1-333-3 and 333-5-333-7) to the second programmable integrated circuit(s). The electronic components are thereby interconnected through the combination of the first and second programmable integrated circuits.
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