Importance

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Abstract

Disclosed is an IC socket for use in testing IC packages, comprising a socket body having a plurality of Y-shaped contact pieces so arranged as to permit them to contact the lead conductors of an IC packages to be tested and a lid which is spring-biased so as to rise up, and is responsive to application of a push for closing and covering the top of the socket body while pushing the lead conductors of the IC package against the contact pieces. the V-shaped head of the contact piece body has the effect of increasing the flexibility with which it accommodates a selected lead conductor, thus assuring that good contact can be made between the lead conductor, thus assuring that good contacts can be made between the lead conductors of the IC package and the contact pieces of the IC socket even after the IC socket is used many times.

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First Claim