Guard ring for integrated circuit package
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United States of America Patent
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-
Aug 13, 1996
Grant Date -
N/A
app pub date -
Jan 13, 1995
filing date -
Jan 13, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is provided a leadframe having a plurality of coplanar electrically conductive leads. At least one metallic guard is bonded to the leads with a dielectric layer disposed between the metallic guard and the leads. The metallic guard has good adhesion to a polymer molding resin such that when the leadframe structure is encased in a molding resin, delamination is minimized. By restricting delamination, the ingress of water and water soluble contaminants to an integrated circuit device is inhibited.
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