Three dimensional package for monolithic microwave/millimeterwave integrated circuits
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United States of America Patent
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Aug 13, 1996
Grant Date -
N/A
app pub date -
Aug 5, 1993
filing date -
Aug 5, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A three-dimensional interconnect package is provided for monolithic microwave/millimeterwave integrated circuits. A mating substrate for receiving an MMIC has transmission lines disposed over its surfaces. The mating substrate mounted substantially vertical in a base substrate which also has transmission lines for carrying microwave/millimeterwave signals. The transmission lines on both substrates are put in electrical contact and microwave/millimeterwave signals are transmitted between the substrates with a minimum of signal loss or reflection.
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