Methods for producing integrated circuit devices
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United States of America Patent
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Aug 20, 1996
Issued Date -
N/A
app pub date -
Jul 13, 1994
filing date -
Sep 14, 1992
priority date (Note) -
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Abstract
A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads. Apparatus for carrying out the method and integrated circuit devices are also described and claimed.
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