Packaging and cooling structure for the personal processor module
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United States of America Patent
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Aug 27, 1996
Grant Date -
N/A
app pub date -
Sep 9, 1994
filing date -
Sep 9, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A housing and cooling structure for a personal processor module (PPM) is provided which includes a case which is sealed and will fit within both a desktop sized docking station and a smaller notebook sized docking station. Within the case, the components which make up the PPM are located in such a way as to minimize the size of the printed circuit boards. In addition, a cooling mechanism is provided which cools all of the components within the case. Also, the PPM has structure for converting 3.3 volt signals into 5 volt signals and for permitting easy upgrades.
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