Using cone shaped search models to locate ball bonds on wire bonded devices
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United States of America Patent
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Aug 27, 1996
Grant Date -
N/A
app pub date -
May 2, 1994
filing date -
May 2, 1994
priority date (Note) -
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Abstract
Method and apparatus for automatically locating the center of a ball bond of a wire to a lead frame and semiconductor chip or similar device; analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform. The present invention constructs a synthetic flattened cone model using a center radius, and monotonically increasing slope values to generate a model having a variation in grey levels, and inner and outer radii that will encompass expected size variations in a ball bond; sets a threshold for acceptable normalized correlation search results; acquires a digitized image of the bond, including a nominal location for the bond; conducts a normalized correlation search of the digitized image at the bond location, using the flattened synthetic cone model; and indicates the presence and location of the expected circular object as the location having the largest coefficient which exceeds a threshold.
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