Laser package with reversed laser diode

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United States of America Patent

PATENT NO 5550852
SERIAL NO

08386413

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A laser package includes a housing and a subassembly to which the critical components of the laser package are mounted. The subassembly is structured to preserve component alignment even in the presence of thermal excursions by ensuring that any movement which might occur effects all the components in a way to preserve alignment. The subassembly is easily removable from the housing and thus permits replacement if a failure should occur. A reverse diode is included to provide a path for reverse currents which otherwise would be damaging to the active laser diode.

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Patent Owner(s)

  • II-VI LASER ENTERPRISE GMBH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Agarwal, Rajiv Arcadia, CA 24 316
Nahapetiance, Henri Glendale, CA 1 33
Patel, Rushikesh M Pomona, CA 8 135

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