Tray for semiconductor devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 3, 1996
Grant Date -
N/A
app pub date -
Jan 23, 1995
filing date -
Sep 7, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A tray for housing semiconductor devices of a ball grid type, each having a surface provided with a plurality of wiring solder balls, the surface of each of the semiconductor devices having peripheral edges, and each of the wiring solder balls having a diameter, includes a tray surface, and pockets formed in the tray surface, each pocket having corners and a shape similar to and slightly larger than the surface of each semiconductor device. Each pocket has a bottom surface forming a depression and having a shape similar to and slightly smaller than the surface of each of the semiconductor devices and a depth larger than the diameter of each wiring solder ball. Each of ribs has a root formed on each corner of each pocket for dividing the pockets from each other and each having a width gradually increasing toward the bottom surface of each pocket. Supporting step portion is formed between the roots of the ribs and the depressions for supporting corresponding ones of the peripheral edges of the surface of each semiconductor device. Each supporting step portion has an inner wall constituting an inner wall of the depression. Projections are formed in the inner wall of the depression for receiving the solder balls which are disposed outermost of the wiring solder balls.
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