Method and apparatus for stencil printing printed circuit boards
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United States of America Patent
Stats
-
Sep 10, 1996
Grant Date -
N/A
app pub date -
Jan 30, 1995
filing date -
Jan 30, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The method includes loading a printed circuit board (PCB) to a printing machine; aligning a stencil to the PCB when the PCB has been loaded to the printing machine; setting a snap-off distance; dispensing a volume of solder paste onto the stencil, the volume of solder paste being dispensed onto the stencil regardless of whether the PCB has been loaded to the printing machine; placing a squeegee in contact with the stencil at a predetermined pressure; moving the squeegee across the stencil at a predetermined speed; waiting a constant period of time; and repeating.
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