Thermal process module for substrate coat/develop system
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United States of America Patent
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-
Sep 10, 1996
Issued Date -
N/A
app pub date -
Oct 11, 1994
filing date -
Jul 16, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a photolithography system, baking and cooling of semiconductor substrates is done in a thermal process module that uses a unique mechanism including pulleys to route vacuum tubing to a transfer arm. Specifically, the mechanism includes a pair of pulleys and a vacuum tube wrapped around the pulleys. The vacuum tube has a movable portion connected to the transfer arm which is reciprocable between the pair of pulleys. The vacuum tube also has a stationary portion that is connected to the movable portion to form an endless loop. The stationary portion of the vacuum tube is rigidly connected to a vacuum supply line in the housing of the thermal process module.
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