Resist formation made by applying, drying and reflowing a suspension of photocurable material
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United States of America Patent
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-
Sep 10, 1996
Grant Date -
N/A
app pub date -
Oct 14, 1993
filing date -
Mar 15, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for the formation of a patterned resist image upon a substrate comprises the steps of: (i) mechanically applying a layer of a suspension of a powdered solid photocurable material in a liquid carrier to the substrate; (ii) drying the resultant layer by evaporation of the liquid carrier and reflowing the powder, under the action of heat, to give a coherent film; (iii) imagewise exposing the dried film to radiation through a patterned mask whereby portions of the film exposed to radiation are cured; and (iv) subsequently developing the exposed film by removing unexposed portions thereof with an appropriate solvent.
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