Magnetron sputter ion plating
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United States of America Patent
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Sep 17, 1996
Issued Date -
N/A
app pub date -
Mar 17, 1994
filing date -
Mar 17, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A magnetron sputter ion plating system has two or more magnetron assemblies spaced around a substrate centrally located relative to the magnetrons. The magnetrons are arranged so that adjacent magnetrons have outer magnetic assemblies of opposite polarity, so that magnetic field lines link adjacent magnetrons, so as to produce a substantially closed ring of magnetic flux. This substantially traps all electrons generated in the system, and increase the level of ionization surrounding the substrates increasing the ion bombardment of the substrates. Several embodiments are disclosed.
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